• TSMC announced a $100 billion investment in the U.S. to build five new semiconductor facilities, including three fabrication plants.
  • The investment is expected to create 40,000 construction jobs over the next four years and reduce U.S. reliance on Asian-made semiconductors.

Taiwan Semiconductor Manufacturing Co. (TSMC) has announced a massive $100 billion investment in the United States to build five new semiconductor facilities. The plan was revealed by TSMC CEO C.C. Wei alongside U.S. President Donald Trump at the White House on Monday.

TSMC, the world’s largest contract chipmaker and a key supplier to major U.S. hardware firms, confirmed that the investment would include three new fabrication plants, two advanced packaging facilities, and a major research and development center.

The initiative aims to strengthen domestic chip production and reduce U.S. reliance on semiconductors manufactured in Asia.

"We must be able to build the chips and semiconductors that we need right here," Trump stated.
"It's a matter of national security for us."

The investment follows TSMC’s previous commitment to expanding its U.S. operations. Last April, the company increased its planned U.S. investment by $25 billion, bringing the total to $65 billion, with plans for a third Arizona factory by 2030. However, TSMC did not specify a timeline for the latest expansion, apart from noting that it would create 40,000 construction jobs over the next four years.

As a crucial supplier to Nvidia, Qualcomm, and AMD, TSMC’s expansion in the U.S. is expected to enhance supply chain security for these firms. The company is also in discussions about a potential joint venture with Intel, which could see TSMC taking a majority stake in Intel’s factory unit.

For Trump, the announcement underscores his commitment to strengthening domestic industries and job creation. It follows similar pledges from Apple, SoftBank, and Emirati billionaire Hussain Sajwani, who have all recently promised significant investments in the U.S.

TSMC emphasized its commitment to advancing semiconductor innovation while working closely with U.S. technology partners.

Edited by Harshajit Sarmah